About the Conference

The ULSIC vs. TFT conference is organized to provide a forum for the discussion on the latest scientific development in two of the most critical high-tech fields, i.e., Ultra Large Scale Integrated Circuits (ULSICs) and Thin Film Transistors (TFTs). It aims to exchange state-of-the-art information among those involved in the research, development, and production. This conference will bring together global experts to exchange opinions on common scientific issues.

The 2023 conference is a continuation of the previous seven successful conferences held in Barga, Italy (2007), Xi’an, China (2009), Hong Kong, China (2011), Grenoble, France (2013), Lake Tahoe, USA (2015), Hernstein, Austria (2017), and Kyoto, Japan (2019). These conferences were attended by worldwide experts and leaders (national academy members, presidents of prestigious universities, presidents and VPs of semiconductor companies, professors, researchers, engineers, etc.) from universities, industry, and national laboratories of more than 20 countries. The maximum number of attendees is limited to 100.

To focus the discussion, we choose some of the most critical challenges on materials, fabrication processes, devices, and applications to discuss. The meeting format is shown below.

Each day is composed of oral presentations mostly by invited speakers in the morning and free discussions in the afternoon.
A panel discussion session is held each evening to exchange opinions on the big picture of technology development.
All attendees will attend the presentations and panels, live, and eat in the same hotel throughout the conference. A Poster Session will be scheduled for students and postdoctoral candidates.
The conference sponsor ECI (Engineering Conferences International) is a not-for-profit global engineering conferences program, originally established in 1962, that provides opportunities for the exploration of problems and issues of concern to engineers and scientists from many disciplines. In addition to Electrochemical Society Electronics and Photonics Division, the technical sponsors in contact are JSAP (Japan Society of Applied Physics), KPS (Korean Physical Society) Semiconductor Division, and others.

Technical Program

ULSIC vs. TFT
Device Physics, Modelling, and Reliability
Semiconductors, Dielectrics, and Interconnect Materials
Advanced Processes and Production Issues
Novel Applications
Panel Discussions on Selective Topics
Poster Presentations